LTCC substrates means low temperature co-fired ceramic substrates. LTCC technology can realize the arrangement of RF circuit in three dimensional space by stacking and co-firing of several LTCC green tapes with metal patterns printed on them. For LTCC technology, the silver or copper is normally used as the material for circuit line. Both of them have high conductivity and low melting point. it requires microwave ceramics should be sintered to dense and got matching shrinkage behavior with metal under 900 or 1000 C.
Glead have self-owned LTCC material technology, advanced embedded components design and simulation ability, stable process control ability. Glead can provide flexible design according to customer requirements. We have the advantages of short delivery time, low cost, reliable quality, etc.
